Flip Chip Package
Flip chip interconnect when higher inputoutput IO counts are needed 1 2. Typical Flip-Chip packages The Flip-Chip package family has been designed to fulfill the same quality levels and the same reliability performances as standard semiconductor plastic packages. Simplified Cross Section Of A Flip Chip Package Which Is Mounted On Pcb Download Scientific Diagram The wafer level package flip chip and UCSP represents a unique packaging form factor that might not perform equally to a packaged product through traditional mechanical reliability tests. Flip chip package . FcFBGA packages are also available in very thin profile hybrid flip chip flip chip on the bottom and wirebond die on the top such as fcTFBGA-SD2 and fcTFBGA-SD3. Micro-bumped flip-chip packages The Flip-Chip package family has been designed to fulfill the same quality levels and the same reliability performances as standard semiconductor plastic packages. AA AA AA AA AA AA AA AA AA FILLET ENCAPSULANT SEMICONDUCTOR CHIP G